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IEEE Transactions on Components, Packaging and Manufacturing Technology

READ: "How to Write for Technical Periodicals & Conferences"

 

IEEE Transactions on Components, Packaging and Manufacturing Technology 

NEW: The IEEE Transactions on Components, Packaging and Manufacturing Technology will now include a Letters section within the publication. Papers will be a maximum of 4 pages and relate to the research and application on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.  The intent of the Letters section is to enable the rapid dissemination of the latest information in topics of interest to the readership of the IEEE Transactions on Components, Packaging and Manufacturing Technology and thus improve dialog across the community.

The technical content of papers must be both new and significant.

Manuscript Length: The standard length for an accepted manuscript must not exceed 4 pages. The 4th page is reserved exclusively for references in order to accommodate a comprehensive reference list of pre-published and to-be-published articles with full authors’ names, title, and DOI (where available). 

When submitting your Letters into ScholarOne, select "Letters" as paper type.

Template Selector

 

          Submit a Paper                          View Current and Past Issue Table of Contents               View top accessed articles

Sours: https://eps.ieee.org/publications/ieee-transactions-on-cpmt.html

Information and Resources for Authors

READ: "How to Write for Technical Periodicals & Conferences"

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

Submit a paper

All papers for the Transactions on CPMT must be submitted for peer-review through SCHOLARONE Manuscripts online review site. 

  • This Publication is a Hybrid journal, allowing both traditional manuscript submission and Open Access (author-pays OA) manuscript submission at the discounted rate of $2,045 per article. Corresponding authors from low-income countries are eligible forwaived or reduced open access APCs.
  • The OA option will be offered to the author at the time the manuscript is submitted. If selected, the OA fee must be paid before the article is published in the journal. If you have unusual circumstances about this, please contact the Editor-in-Chief. 
  • The traditional option, if selected, enables access to all qualified subscribers and purchasers via IEEE Xplore. No OA payment is required. 
  • The IEEE peer review standard of excellence is applied consistently to all submissions. All accepted articles will be included in the print issue mailed to subscribers. The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE Publication Services and Products Board Operations Manual (https://pspb.ieee.org/images/files/files/opsmanual.pdf). Each published article is reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance.

Content

The technical content of papers should be both new and significant. Experimental data should be complete and should include sufficient descriptions of experimental apparatus, methods, and relevant experimental conditions. References should be thorough and complete.

Papers Presented at Conferences

Papers previously or planned to be presented at/published by conferences will be considered for publication under the following conditions.

  • The author must disclose information on conference presentation when the paper is submitted for review.
  • The author must significant additions/modification to the paper. This could include: new data and detailed analysis of the experimental results; addition of references to the previous work of others (not previous work by the authors); a discussion of the previous work and how the author’s work expands or builds on the previous work: a discussion of how the author’s results compare/contrast the previous work; etc.
  • The author must include a reference the previously published paper in the reference section.
  • The author should modify the title to reflect the fact that  the paper has been “significantly” modified.
  • A description of the modifications must be provided at the time of submission (either in the Author’s cover letter, or in a file uploaded with the manuscript.

Resources for Authors       

The IEEE Author Center contains tools and information to assist with article preparation and submission, the article proof review process, ordering reprints, and other helpful tips and guidelines. 

  • IEEE Style Manual  
    A manual outlining editorial guidelines for IEEE Transactions, Journals, and Letters.
  • Keywords Suggested for Authors 
    Using the right keywords in your article can make your article more easily and reliably discoverable, which leads to a broader readership for your article
  • Article Templates 
    Includes templates and instructions on how to prepare your papers for publication in IEEE Transactions and Journals.
  • Refine the Use of English in Your Manuscript
    A professional editing service available for authors looking to refine and polish the content of their papers for a fee.
  • Reference Preparation Assistant
  • Use this tool to upload your reference draft file and validate your references against both the IEEE Xplore and CrossRef databases in order to ensure successful online linking.
  • IEEE PDF Checker
    Use this tool to upload your current draft PDF so that it may get checked against the latest IEEE Xplore journal requirements. Your results are e-mailed to you, and also displayed in real time on the site. The tool will give you an Xplore-compliant version of your paper.
  • How to Write your Abstract
    Use these specifications to make your abstract self-contained and well abbreviated.
  • Author Names in Native Languages  
    Use this for font styles used when rendering Chinese, Japanese, Korean and other lanuage characters in the final publication.
  • Creating Graphics for your article
    Information on creating graphics and requirements 
  • Instructions for the Preparation of Multimedia Materials 
    Instructions on how to include multimedia in your paper.
  • Instructions for Producing a Video 
    Tips and instructions on how to produce and submit digital video files for inclusion in your paper.
  • Instructions for Creating a README File for Supplemental Material (PDF, 72 KB) 
    Instructions and a checklist of items required in README files accompanying supplemental material.
  • Graphical Abstract description  (PDF, 265 KB)
    Use the graphical abstract for a concise, illustrative reflection of the content of your article.
  • Author Proof Login 
    Web site where IEEE authors can keep track of, and provide input on, their articles throughout the production process.
  • Instructions for Authors on Reprints and Special Charges (PDF, 140 KB)
    Explains extra charges you may incur, such as overlength page charges, color in print, and open access, along with attaining reprints.
Sours: https://eps.ieee.org/publications/ieee-transactions-on-cpmt/information-and-resources-for-authors.html
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NEW: Letters section within IEEE T-CPMT

NEW: The IEEE Transactions on Components, Packaging and Manufacturing Technology will now include a Letters section within the publication. Papers will be a maximum of 4 pages and relate to the research and application on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.  The intent of the Letters section is to enable the rapid dissemination of the latest information in topics of interest to the readership of the IEEE Transactions on Components, Packaging and Manufacturing Technology and thus improve dialog across the community.

The technical content of papers must be both new and significant.

Manuscript Length: The standard length for an accepted manuscript must not exceed 4 pages. The 4th page is reserved exclusively for references in order to accommodate a comprehensive reference list of pre-published and to-be-published articles with full authors’ names, title, and DOI (where available). 

When submitting your Letters into ScholarOne, select "Letters" as paper type.

Template for Letters in Transactions

Sours: https://eps.ieee.org/publications/enews/october-2018/388-new-letters-section-within-ieee-t-cpmt.html
Optical Networking at Scale with Intel Silicon Photonics

From CPMT (Components, Packaging, and Manufacturing Technology) to EPS

Author: Jim Morris

Old friends Ron Gedney (CPMT President 1990-1991) and Jim Morris met up again for the first time since the mid-90's in Florida where Ron lives in retirement in Daytona and Jim was attending TAB meetings in Lake Buena Vista. Ron jump-started Jim's 25-year career in multiple CPMT roles when he appointed Jim as CPMT Treasurer in 1990. Ron worked at IBM-Endicott while Jim was just down the road at SUNY-Binghamton and had just been recruited to assist with Bob Howard's new initiatives as the VP of Education. At the time, the CPMT Society had around $150K in the bank and was losing $70K/year, so the outcome was not hard to predict if we did not do something. We proposed and the Board eventually approved a simple change in conference planning. Instead of planning for break-even conferences, we planned for a 15% surplus. Conferences immediately stopped losing money. The Society was also suffering the results of a surfeit of success as the Transactions grew far beyond the budgeted page count. Much to everyone's surprise, when we described our situation, IEEE approved a subscription increase for the Transactions that exceeded all the rules. Although there were some hard feelings when the BoG withdrew its previous support for the Holm Conference's new student scholarship, everyone supported the ten-year goal of establishing a reserve of one year's expenses, and were astonished when it was achieved within less than two years. In the following 25 years, Jim served as Treasurer (1990-1997), Conferences VP (1998-2003), Transactions AE (1998-2015), three terms on the BoG, roughly 20 years on three different ECTC program committees, as General Chair of four CPMT conferences, and in various other roles especially with conferences. 

Read More

Sours: https://eps.ieee.org/publications/enews/april-2020/568-from-cpmt-components,-packaging,-and-manufacturing-technology-to-eps.html

Ieee cpmt

2021 IEEE 66th Holm Conference on Electrical Contacts (HLM)San Antonio, TX USAOct 23, 2021 - Oct 26, 2021

2021 IEEE International 3D Systems Integration Conference (3DIC)CA, USAOct 25, 2021 - Oct 28, 2021

2021 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)Tel Aviv, IsraelOct 31, 2021 - Nov 2, 2021

2021 IEEE CPMT Symposium Japan (ICSJ)Kyoto, JapanNov 9, 2021 - Nov 11, 2021

2021 IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP)Milpitas, CA USANov 10, 2021 - Nov 11, 2021

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)SingaporeNov 30, 2021 - Dec 2, 2021

2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)Urbana, IL USADec 12, 2021 - Dec 14, 2021

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)Taipei, TaiwanDec 20, 2021 - Dec 22, 2021

2022 IEEE Design and Technology of Modern Electronic Systems (DTMES)Addis Ababa, EthiopiaFeb 7, 2022 - Feb 9, 2022

2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)Saratoga Springs, NY USAMay 1, 2022 - May 4, 2022

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)San Diego, CA USAMay 29, 2022 - Jun 3, 2022

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)San Diego, CA USAMay 30, 2022 - Jun 2, 2022

2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)Aalborg East, DenmarkAug 23, 2022 - Aug 25, 2022

2022 IEEE 67th Holm Conference on Electrical Contacts (HLM)Tampa, FL USAOct 22, 2022 - Oct 25, 2022

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)TX, USAMay 28, 2023 - Jun 2, 2023

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)San Diego, CA USAMay 26, 2024 - May 31, 2024

2025 IEEE 75th Electronic Components and Technology Conference (ECTC)Orlando, FL USAMay 25, 2025 - May 30, 2025

2025 IEEE 70th Holm Conference on Electrical Contacts (HLM)San Antonio, TX USAOct 14, 2025 - Oct 21, 2025

2026 IEEE 76th Electronic Components and Technology Conference (ECTC)San Diego, CA USAMay 24, 2026 - May 29, 2026

2027 IEEE 77th Electronic Components and Technology Conference (ECTC)Las Vegas, NV USAMay 30, 2027 - Jun 4, 2027

2028 IEEE 78th Electronic Components and Technology Conference (ECTC)Grapevine, TX USAMay 28, 2028 - Jun 2, 2028

2029 IEEE 79th Electronic Components and Technology Conference (ECTC)Orlando, FL USAMay 27, 2029 - Jun 1, 2029

Sours: https://eps.ieee.org/
Por que ser IEEE ?

IEEE Electronics Packaging Society

The IEEE Electronics Packaging Society (EPS), formerly the IEEE Components, Packaging & Manufacturing Technology Society, is a professional society of the IEEE that deals with the advancement of microsystems packaging and manufacture.[1]

History[edit]

The IEEE Components, Packaging & Manufacturing Technology Society was created from a merger between the IEEE Parts, Hybrids, and Packaging Group and the IEEE Manufacturing Technology Group in 1978. The IEEE Parts, Hybrids, and Packaging Group was originally formed in September 28, 1954 as the IRE Professional Group on Production Techniques, which changed its name several times. The evolution of the group's names is as follows: the IRE Professional Group on Product Engineering and Production (1960), the Professional Technical Group on Product Engineering and Production (1963), IEEE Product Engineering and Production Group (1964), Parts, Materials, and Packaging Group (1965), and the IEEE Parts, Hybrids, and Packaging Group (1971).[2]

Fields of Interest[edit]

The IEEE CPMT Society's mission is to "provide a forum for the dissemination of technical information within its assigned areas. CPMT's fields of interest encompass the materials science, chemical processes, reliability technology, mathematical modelling, education and training utilized in the design and production of discretes, hybrids, and electronic packaging".[3]

Publications[edit]

The society publishes a range of notable peer-reviewed transactions and other publications [4] including:

Conferences[edit]

IEEE CPMT sponsors a number of internationally attended conferences on an annual basis that focus on its field of interest.[citation needed]

See also[edit]

References[edit]

Sours: https://en.wikipedia.org/wiki/IEEE_Electronics_Packaging_Society

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